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Thermal Adhesive Tape, 25m x 30mm x 0.20mm Double Side Thermal Tapes Cooling Hea
Thermal Adhesive Tape, 25m x 30mm x 0.20mm Double Side Thermal Tapes Cooling Hea
Thermal Adhesive Tape, 25m x 30mm x 0.20mm Double Side Thermal Tapes Cooling Hea
Thermal Adhesive Tape, 25m x 30mm x 0.20mm Double Side Thermal Tapes Cooling Hea
Thermal Adhesive Tape, 25m x 30mm x 0.20mm Double Side Thermal Tapes Cooling Hea
Thermal Adhesive Tape, 25m x 30mm x 0.20mm Double Side Thermal Tapes Cooling Hea
Thermal Adhesive Tape, 25m x 30mm x 0.20mm Double Side Thermal Tapes Cooling Hea

Thermal Adhesive Tape, 25m x 30mm x 0.20mm Double Side Thermal Tapes Cooling Hea

$ 10.3

Availability: 100 in stock
  • Manufacturer: HOAOH
  • Brand: HOAOH
  • UPC: 7445057638685
  • EAN: 07445046096069
  • Item must be returned within: 30 Days
  • Color: Does Not Apply
  • Size: 25m x 30mm x 0.20mm
  • MPN: Does Not Apply
  • Model: Does Not Apply
  • Restocking Fee: No
  • All returns accepted: Returns Accepted
  • Refund will be given as: Money Back
  • Condition: New
  • Return shipping will be paid by: Buyer

    Description

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    Thermal Adhesive Tape, 25m x 30mm x 0.20mm Double Side Thermal Tapes Cooling Heatsink Pad Apply to LED, IGBT IC Chip Computer CPU GPU Modules MOS Tube SSD Drives
    Description
    ❀ Thermal Adhesive Tape is a simple and practical tape, easy to install, easy to use, easy to eliminate.
    ❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression.
    ❀ EFFICIENT THERMAL CONDUCTIVITY - The Thermal Pad based on silicone & a special filler outperforms generic and performance pads by far. The Thermal Conductivity amounts to 2.0 W/mK.
    ❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression. ✔Widely used in most electronic devices,High tensile strength and strong adhesion hold the device firmly in place, to achieve the most effective thermal dissipation
    ❀ Used for fill the uneven surface,Can be tightly and firmly fit the heat source devices and heat sink,heat sink and IC chip bonding, high power LED and heat aluminum bonding.
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