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NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing Soldering

$ 5.26

Availability: 100 in stock
  • Return shipping will be paid by: Buyer
  • Particle Size: 1-10μm
  • Model Number: 559
  • Origin: CN(Origin)
  • MPN: Does not apply
  • Item must be returned within: 30 Days
  • Brand: XMSJ
  • Condition: New
  • Restocking Fee: No
  • Refund will be given as: Money Back
  • All returns accepted: Returns Accepted

    Description

    High quality lead free solder fusing paste, free shipping, NC-559-ASM, 100g, for  BGA repair solder repair
    Model: NC-559-ASM
    Volume: 100 g/bottle
    It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and for mounting operations such as pulling Chip attachment to PCB substrates. It is a necessary and useful tool in BGA repair.
    Feature::
    Excellent welding adhesion ability
    Excellent anti-humidity capability
    Widely used in BGA, PGA, CSP packages and flip chip operation
    Suitable for multiple PCB reflux
    Non-clean and lead free for environmental protection